This is what FachPack 2018 has to offer.
Hybrid Electronics for Smart Packaging
The usage of printed functionalities like conductive tracks, insulators, sensors, batteries and simple displays is attracting more and more interest in the designer and packaging industry. The combination of both, printed functionalities and conventional electronics is still challanging but opens a wide variety of possibilities for functionalized packages and labels. The talk will introduce you to some design and integration concepts like self-lighting packaging, NFC communication and sensor integration along with some examples for application.
--- Date: 27.09.2018 Time: 1:25 PM - 1:45 PM Location: TechBox Forum Hall 3, stand 3-242