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24 - 26 September 2019 // Nuremberg, Germany

This is what FachPack 2018 has to offer.

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New technologies for more efficient packaging processes

Digital heating – maximum flexibility and quality in sealing and thermoforming Vortragssprache Deutsch Simultanübersetzung Englisch

For the first time, a heating process is permitting defined inhomogeneous contact heating during thermoforming and sealing. A large number of small 5mm x 5mm heating circuits generate a defined temperature profile on the surface of the heater that is then conveyed almost completely digitally by software. This also makes spatially resolved reproduction of the actual surface temperatures possible.

--- Date: 26.09.2018 Time: 2:50 PM - 3:10 PM Location: TechBox Forum Hall 3, stand 3-242

Presented by:

Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV

Speakers

Dr. Sascha Bach

Dr. Sascha Bach

watttron GmbH

Presenter

 Andrea Liebmann

Andrea Liebmann

Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV

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