This is what FachPack 2018 has to offer.
Digital heating – maximum flexibility and quality in sealing and thermoforming
For the first time, a heating process is permitting defined inhomogeneous contact heating during thermoforming and sealing. A large number of small 5mm x 5mm heating circuits generate a defined temperature profile on the surface of the heater that is then conveyed almost completely digitally by software. This also makes spatially resolved reproduction of the actual surface temperatures possible.
--- Date: 26.09.2018 Time: 2:50 PM - 3:10 PM Location: TechBox Forum Hall 3, stand 3-242
Speakers
Dr. Sascha Bach
watttron GmbH
Presenter
Andrea Liebmann
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV