This was the programme of FACHPACK 2019
Marketplace Smart Packaging – printed Electronics and more
An event in cooperation with
Modern communication is digital, fast, versatile and therefore sophisticated. Information on products and companies is usually available at the click of a mouse. However, long-term business relationships are still personally closed and maintained. And new concepts are created through the exchange of experience.
The Smart Packaging marketplace offers the best of all worlds. It combines the 24/7 presence of topic-relevant online portals with an efficient trade fair presence for high-quality contacts and discussions at the leading trade fair for packaging in Europe as well as a Thinktank for the exchange of experience among experts.
Packaging users are confronted with ever greater challenges. Digitization, networking and industry 4.0 are already high on the list of requirements of numerous companies. Customers are demanding new intelligent applications and added value for their packaging solutions. Printed Electronics is an innovative technology that is now making its way into practical applications. Intelligent packaging and new materials create new purchasing incentives and additional benefits for consumers.
The topics of the marketplace are therefore exciting and topical: Printed Electronics - on the way to digital packaging. Smart packaging solutions as a marketing and sales tool. New materials for more functionality and sustainability, and much more.
These topics will be complemented by a think tank in which experts from research, industry and science will discuss new approaches and concepts for modern packaging solutions.
The cross-media concept of the Smart Packaging marketplace combines the theme-specific trade fair appearance at Fachpack with the media competence of the dfv Mediengruppe trade titles.
The Smart Packaging marketplace is located in hall 9, stand 9-307.