https://www.fachpack.de/en/ausstellerprodukte/fachpa19/product-10202132/perfoline-von-der-mikroperforation-fuer-map-anwendungen-im-frischebereich-bis-zur-vollflachigen-perforation-mit-ueber-1-000-000-loecher-sekunde

Product 3: PerfoLine

From micro-perforation for MAP applications in the freshness sector to full-surface perforation with over 1,000,000 holes/ second

Fine perforations with the laser ensure that your packaging breathes. A controlled oxygen exchange ensures that the contents remain fresh and durable for longer. The method is called Modified Atmosphere Packaging (MAP). Microscopic, precise holes of 60µm – 100µm in diameter ensure an optimal climate.
The micro-perforation even controls the exchange of certain gases that, for example, accelerate the ripening process of cheese.

With the Web Speed Compensation WSC technology developed by us, you can perforate foils with holes in a consistent round shape at web speeds of up to 600 m/min. Our technology allows constant quality even when the speed changes during the acceleration.

PerfoControl – Inline process control

Process control is becoming increasingly important, which has led to the development of the PerfoControl module at LANG LASER. With this system, every hole from a diameter of 50 microns up to 300 microns or more is detected even at web speeds of up to 300m/min and measured in its diameter. The values are then visualized via a diagram. For quality control, limit-values for the inline process can be specified.

For perforation all over the web, we offer system solutions from the narrow web up to 2 meter wide material webs, with individual arrangement of the holes. During perforation, the hole diameter or the hole depth (sack holes) can be freely selected. Depending on the hole matrix, very high web speeds can be achieved with a perforation performance of 1,000,000 holes/second.

Perforation of the finest technology:

Micro-perforation for MAP
Inline process control (100% control – circular area calculation)
Consistent hole quality thanks to Web Speed Compensation WSC technology
Extremly high perforation performance > 1.000.000 holes / second
Freely selectable arrangement and diameter of the holes
Constant hole diameter even in case of speed changes
Web widths up to 2 meters
Use for a wide range of materials or material combinations

Since 1992 LANG LASER System GmbH stands for successful solutions in the area of industrial laser material processing. A network of experienced specialists, external consultants, research- and development institutions allows us, to provide our customers with a range of products and services at the highest international level.

As a family business we offer competent and reliable a wide range of industry-specific system solutions and services.
Thereby, our main markets include the packaging, cardboard and paper industry, as well as the security technology for international passports, bank notes etc. Our system solutions are created for applications such as cutting, perforating, scoring/scribing, structuring and marking, special solutions integrate precisely into your production processes.

Since 2018, we develop laser processes for the production of sustainable packaging solutions. This involves for example the mass production of trays made of renewable raw materials and the direct marking/coding of products without the use of ink.

Visit our Competence Center;

The creative development team of LANG LASER shows in our hygienic area (HACCP/BRC) on various slitters and winders diverse and demanding laser applications. See our complete repertoire of complex contours on different materials and discover new possibilities for making your packaging fit for the future. You are warmly invited to conduct your tests in our Competence Center.